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Model F Series
Soldering System
Environmentally
friendly—eliminates use of solvents
Ultrasonic soldering works without using flux
Can simplify soldering, even on the surface of nickel
Unnecessary to pre- or post-clean parts (ultrasonic
vibration has cleaning effect)
Possible to solder fine pitch, to 0.3mm
Computer control and monitoring can be used with soldering
system
Applications
Epoxy Substrate
Gold plated
Min. pitch = 0.2mm
Gap = 0.1mm
Pretinning of PGA
Gold plated Ni-Alloy
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Dukane Corporation l
2900 Dukane Drive l St. Charles, IL
60174 l (630) 797-4900
Copyright 2001 Dukane Corporation. All rights reserved.
Revised 03/30/2007